SMIC To Expand Wafer Capacity By Year-End

by Paul Denlinger

Posted Sept. 3, 2004

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SMIC (Semiconductor Manufacturing International Corp.), one of the leading chip foundries in Shanghai, plans to expand its 200 mm wafer capacity from the current monthly capacity of 100,000 to 125,000 by year-end. By 2005, it plans to boost monthly production to 185,000.

This runs in contrast to Intel's recent announced cut in earnings projections, and suggest that demand remains strong. SMIC believes that it will continue to manufacture at or near full capacity throughout 2005.

High initial capital investments for foundries require that they utilize 70% of their capacity before they can break even. The cyclical nature of the business means that if they hit a bad economic cycle, they are unable to recoup their equipment investment in a new generation of manufacturing and testing equipment, which may require US$1-5 billion of capital for each new foundry.

SMIC has been able to perform well, even with a rocky IPO in the US earlier in the US. The company has also been sued in the US by TSMC (Taiwan Semiconductor Manufacturing Co.), which contends that SMIC has violated the intellectual property rights of TSMC and hired some of its leading engineers and management. Recently, TSMC has attempted to block the export of SMIC chips to the US on these grounds.

TSMC is the largest chip foundry in the world, and is widely regarded as the "grandfather" of almost all the other chip foundries in Taiwan and China.

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